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TTM Expands Defense Electronics Production With New York Facility

TTM Technologies logo. TTM has opened an Ultra-HDI printed circuit board manufacturing facility in New York.
TTM Technologies
  • TTM Technologies has opened an Ultra-HDI manufacturing facility in New York
  • The $130 million project includes a $30 million Department of War investment
  • The facility is expected to create up to 400 jobs

TTM Technologies has opened a new Ultra-High-Density Interconnect, or Ultra-HDI, printed circuit board manufacturing facility in Syracuse, New York, to expand domestic production capacity for aerospace and defense electronics.

The company said Monday the 215,000-square-foot facility represents a $130 million investment, including $30 million from the Department of War. It is expected to create up to 400 engineering and manufacturing jobs, increasing TTM’s total workforce in Central New York to approximately 1,000 employees.

How Will the Facility Support Defense Programs?

According to TTM, the facility is purpose-built for Ultra-HDI PCB and advanced packaging manufacturing. The company said the technology supports electronics used in radar systems, missile defense architectures, space-based sensors and autonomous systems.

TTM added that Ultra-HDI PCBs enable increased miniaturization and performance density in advanced electronic systems.

Cathie Gridley, executive vice president and president of aerospace and defense at TTM Technologies, said the facility expands domestic Ultra-HDI manufacturing capabilities for defense customers.

“This investment strengthens the U.S. microelectronics supply chain, deepens our commitment to Central New York, and positions TTM to support the next generation of defense and national security technologies for decades to come,” Gridley added.

What Is TTM Technologies?

TTM Technologies is a manufacturer of mission systems, radio frequency components, microelectronic assemblies and interconnect products for defense, aerospace and high-technology markets.

In January, TTM received a potential three-year, $200 million contract from RTX Technologies business Raytheon to provide RF assemblies, electronic hardware and printed circuit boards for the Lower Tier Air and Missile Defense Sensor system.

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Written by Jane Edwards

is a staff writer at Executive Mosaic, where she writes for ExecutiveBiz about IT modernization, cybersecurity, space procurement and industry leaders’ perspectives on government technology trends.

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